The Information says TSMC may develop and produce 3D DRAM, a technology that stacks memory chips vertically to increase bandwidth and capacity while improving power efficiency. The report does not provide further details about the company’s plans.
TSMC reportedly weighs a return to memory chips
TSMC is considering re-entering the memory market, with a possible focus on next-generation 3D DRAM, according to a report by The Information. The move could put the world’s largest chipmaker in competition with Micron, Samsung and SK Hynix as demand outpaces supply and prices remain high.
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