The collaboration focuses on three critical equipment families designed to standardize metalens fabrication within existing semiconductor workflows. Central to this effort is a 12-inch Direct Laser Writer platform, which upgrades MetaOptics’ current 4-inch prototyping tool. By enabling simultaneous multi-lens writing for thousands of units at a 0.1mm diameter, the new platform aims to facilitate mass production of co-packaged optics with higher uptime and easier maintenance.
Supporting this hardware are wafer-level automatic testers and integrated assembly systems. These tools perform active sub-micron alignment and UV-cured bonding, streamlining the assembly of metalens modules for applications ranging from smartphone cameras to augmented reality glasses. The systems are designed to operate across a broad electromagnetic spectrum, covering visible light from 425nm up to short-wave infrared bands at 1310nm.





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